[IEEE 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Chengdu, China (2017.7.4-2017.7.7)] 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Failure analysis methodology on center patch issue due to salicidation in wafer fab
Xu, N. Y., Teo, Angela, Ng, H. P., Ang, G. B., Chen, C. Q., Jerome, A., Mai, Z. H., Lam, J.Year:
2017
Language:
english
DOI:
10.1109/IPFA.2017.8060185
File:
PDF, 822 KB
english, 2017