Self-Assembly and Electrostatic Carrier Technology for Via-Last TSV Formation Using Transfer Stacking-Based Chip-to-Wafer 3-D Integration
Hashiguchi, Hideto, Fukushima, Takafumi, Hashimoto, Hiroyuki, Bea, Ji-Cheol, Murugesan, Mariappan, Kino, Hisashi, Tanaka, Tetsu, Koyanagi, MitsumasaVolume:
64
Language:
english
Journal:
IEEE Transactions on Electron Devices
DOI:
10.1109/ted.2017.2767598
Date:
December, 2017
File:
PDF, 4.62 MB
english, 2017