Effect of voids on thermo-mechanical reliability of chip resistor solder joints: Experiment, modelling and simulation
Wild, P., Lorenz, D., Grözinger, T., Zimmermann, A.Volume:
85
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2018.04.014
Date:
June, 2018
File:
PDF, 5.42 MB
english, 2018