![](/img/cover-not-exists.png)
[IEEE 2016 IEEE International 3D Systems Integration Conference (3DIC) - San Francisco, CA, USA (2016.11.8-2016.11.11)] 2016 IEEE International 3D Systems Integration Conference (3DIC) - Improved noise coupling performance using optimized Teflon liner with different TSV structures for 3D IC integration
Patil, Suraj, Kumar Panigrahi, Asisa, Bonam, Satish, Hemanth Kumar, C., Krishan Singh, Om, Govind Singh, ShivYear:
2016
Language:
english
DOI:
10.1109/3dic.2016.7970021
File:
PDF, 772 KB
english, 2016