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[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Will Low-Cost 3D Additive Manufactured Packaging Replace the Fan-Out Wafer Level Packages?
Tiedje, Tobias, Lungen, Sebastian, Schubert, Martin, Luniak, Marco, Nieweglowski, Krzysztof, Bock, KarlheinzYear:
2017
Language:
english
DOI:
10.1109/ECTC.2017.276
File:
PDF, 877 KB
english, 2017