[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - A Unique Temporary Bond Solution Based on a Polymeric Material Tacky at Room Temperature and Highly Thermally Resistant Application Extension from 3D-SIC to FO-WLP
Phommahaxay, Alain, Potoms, Goedele, Bertheau, Julien, Bex, Pieter, Duval, Fabrice, Podpod, Arnita, Wang, Teng, Verbinnen, Greet, Beyer, Gerald, Sleeckx, Erik, Beyne, Eric, Nakamura, Atsushi, Kamochi,Year:
2017
Language:
english
DOI:
10.1109/ECTC.2017.50
File:
PDF, 1.90 MB
english, 2017