A Study on the Bonding Conditions and Nonconductive Filler Contents on Cationic Epoxy-Based Sn–58Bi Solder ACFs Joints for Reliable Flex-on-Board Applications
Zhang, Shuye, Lin, Tiesong, He, Peng, Zhao, Ning, Huang, Mingliang, Paik, Kyung-WookVolume:
7
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2017.2761784
Date:
December, 2017
File:
PDF, 3.01 MB
english, 2017