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[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Characterization of Dual Side Molding SiP Module
Lai, Jin-Yuan, Chen, Tang-Yuan, Wang, Ming-Han, Shih, Meng-Kai, Tarng, David, Hung, Chih-PinYear:
2017
Language:
english
DOI:
10.1109/ectc.2017.113
File:
PDF, 1.19 MB
english, 2017