[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Finite-element calculations of elastic fields within flip-chip solder bumps and Cu-pillar bumps under the influences of thermal stresses and joule heating
Zhou, Peng, Zhao, Baojie, Zhen, Yubao, Liu, Shuo, Hu, Yuehua, Li, JiayuYear:
2017
Language:
english
DOI:
10.1109/ICEPT.2017.8046519
File:
PDF, 2.92 MB
english, 2017