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[IEEE 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Investigation of internal package structure based on the analysis of dynamic temperature response
Janicki, Marcin, Torzewicz, Tomasz, Napieralski, AndrzejYear:
2016
Language:
english
DOI:
10.1109/itherm.2016.7517587
File:
PDF, 904 KB
english, 2016