[IEEE 2016 IEEE International 3D Systems Integration Conference (3DIC) - San Francisco, CA, USA (2016.11.8-2016.11.11)] 2016 IEEE International 3D Systems Integration Conference (3DIC) - Novel inter layer dielectric and thermal TSV material for enhanced heat mitigation in 3-D IC
Khurram, Kumail, Kumar Panigrahi, Asisa, Bonam, Satish, Krishan Singh, Om, Govind Singh, ShivYear:
2016
Language:
english
DOI:
10.1109/3dic.2016.7970005
File:
PDF, 782 KB
english, 2016