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[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Development of Solder Resist with Improved Adhesion at HTSL (175 deg C for 3000 Hours) and Crack Resistance at TST for Automotive IC Package
Ueta, Chiho, Okada, Kazuya, Shiina, Toko, Hanada, Tadahiko, Ito, NobuhitoYear:
2017
Language:
english
DOI:
10.1109/ECTC.2017.198
File:
PDF, 4.42 MB
english, 2017