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[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Thermo-Compression Bonding and Mass Reflow Assembly Processes of 3D Logic Die Stacks
Gagnon, Pascale, Bergeron, Christian, Langlois, Richard, Barbeau, Stephane, Whitehead, Steve, Tyberg, Christy, Robertazzi, Ray, Sakuma, Katsuyuki, Wordeman, Matthew, Scheurmann, MichaelYear:
2017
Language:
english
DOI:
10.1109/ECTC.2017.53
File:
PDF, 1.37 MB
english, 2017