[IEEE 2017 IEEE Electrical Design of Advanced Packaging and...

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[IEEE 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Haining (2017.12.14-2017.12.16)] 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Signal integrity analysis of a super speed pair of a USB 3.0 connector with test Jig

Kim, Hyesoo, Park, Shinyoung, Kim, Jonghoon, Kim, Joungho, Park, Jung-Min, Kim, Un-Ho, Jeon, Yuck-Hwan
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Year:
2017
Language:
english
DOI:
10.1109/EDAPS.2017.8277031
File:
PDF, 1.02 MB
english, 2017
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