[IEEE 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Haining (2017.12.14-2017.12.16)] 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Signal integrity analysis of a super speed pair of a USB 3.0 connector with test Jig
Kim, Hyesoo, Park, Shinyoung, Kim, Jonghoon, Kim, Joungho, Park, Jung-Min, Kim, Un-Ho, Jeon, Yuck-HwanYear:
2017
Language:
english
DOI:
10.1109/EDAPS.2017.8277031
File:
PDF, 1.02 MB
english, 2017