[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Influence of thermomigration on creep behavior of Cu/Sn0.7Cu/Cu solder joint
Wei, Guo-qiang, Ma, Si, Li, Da-lei, Jia, Yin-pei, Liu, Heng-linYear:
2017
Language:
english
DOI:
10.1109/ICEPT.2017.8046399
File:
PDF, 1.24 MB
english, 2017