[IEEE 2017 18th International Conference on Electronic...

  • Main
  • [IEEE 2017 18th International...

[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Modelling the impact of conformal coating penetration on QFN reliability

Yin, Chunyan, Stoyanov, Stoyan, Bailey, Chris, Stewart, Paul
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2017
Language:
english
DOI:
10.1109/ICEPT.2017.8046616
File:
PDF, 1.35 MB
english, 2017
Conversion to is in progress
Conversion to is failed