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[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Modelling the impact of conformal coating penetration on QFN reliability
Yin, Chunyan, Stoyanov, Stoyan, Bailey, Chris, Stewart, PaulYear:
2017
Language:
english
DOI:
10.1109/ICEPT.2017.8046616
File:
PDF, 1.35 MB
english, 2017