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[IEEE 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Chengdu, China (2017.7.4-2017.7.7)] 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Novel sample preparation and high-resolution X-ray tomography for package FA
Schmidt, Christian, Kelly, Stephen T., Wang, Ying, Coyle, S. T., Shearer, Michael HasselYear:
2017
Language:
english
DOI:
10.1109/IPFA.2017.8060174
File:
PDF, 328 KB
english, 2017