[IEEE 2017 16th IEEE Intersociety Conference on Thermal and...

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[IEEE 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL (2017.5.30-2017.6.2)] 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Embedded two-phase cooling of high heat flux electronics on silicon carbide (SiC) using thin-film evaporation and an enhanced delivery system (FEEDS) manifold-microchannel cooler

Bae, Daniel G., Mandel, Raphael K., Dessiatoun, Serguei V., Rajgopal, Srihari, Roberts, Samantha P., Mehregany, Mehran, Ohadi, Michael M.
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Year:
2017
DOI:
10.1109/ITHERM.2017.7992511
File:
PDF, 595 KB
2017
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