Full-Chip Thermal Simulation of Superconductor...

IEEE Transactions on Appiled Superconductivity 2018 / 1 Vol. 28; Iss. 1

Full-Chip Thermal Simulation of Superconductor Transition-Edge Sensor Circuits

Chen, Jun-Kang, Wang, Tian-Shun, Zhou, Xingxiang
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Volume:
28
Language:
english
Journal:
IEEE Transactions on Applied Superconductivity
DOI:
10.1109/TASC.2017.2769453
Date:
January, 2018
File:
PDF, 1.29 MB
english, 2018
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