TSV Repair Architecture for Clustered Faults

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IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems 2018

TSV Repair Architecture for Clustered Faults

Jang, Jaewon, Cheong, Minho, Kang, Sungho
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Year:
2018
Language:
english
Journal:
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
DOI:
10.1109/TCAD.2018.2808453
File:
PDF, 353 KB
english, 2018
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