[IEEE 2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) - Bordeaux, France (2017.5.29-2017.6.1)] 2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) - Reliability of ball grid array subjected to temperature cycling
Chuang, Wan-Chun, Tsai, Ben, Chen, Wei-Long, Su, JoshYear:
2017
Language:
english
DOI:
10.1109/dtip.2017.7984491
File:
PDF, 308 KB
english, 2017