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[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Multi DOE Study on 28nm (RF) WLP Package to Investigate BLR Performance of Large WLP Die with 0.35mm Ball Pitch Array
Alvarado, Rey, Keser, Beth, Cui, Tong, Syed, Ahmer, Xu, Steven, Roggeman, BrianYear:
2017
Language:
english
DOI:
10.1109/ectc.2017.304
File:
PDF, 703 KB
english, 2017