[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - High efficient Pd-based bimetallic alloyed catalyst for Electroless deposition of metallic copper
Sheng, Jia-Li, Kang, Jia-Hui, Fu, Xian-Zhu, Sun, Rong, Wong, Ching-PingYear:
2017
Language:
english
DOI:
10.1109/icept.2017.8046581
File:
PDF, 490 KB
english, 2017