[IEEE 2017 18th International Conference on Electronic...

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[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - A significant blocking effect of Ni plating layer on the diffusion of Zn element of brass substrate

Dong, YunSong, Ding, Ying, Wang, Xiuli, Wu, Guangdong, Xiao, Bo, Tian, Yanhong
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Year:
2017
Language:
english
DOI:
10.1109/icept.2017.8046753
File:
PDF, 1.61 MB
english, 2017
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