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[IEEE 2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) - Burlingame, CA (2017.10.16-2017.10.19)] 2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) - Investigations on contact punch-through in 28 nm FDSOI through virtual fabrication
Vianne, B., Morin, P., Beylier, C., Giraudin, J.-C., Desmoulins, S., Gonella, R., Juncker, A., Fried, D.Year:
2017
Language:
english
DOI:
10.1109/s3s.2017.8309236
File:
PDF, 932 KB
english, 2017