Electromigration and Thermomechanical Fatigue Behavior of...

Journal of Electronic Materials 2018 / 3 Vol. 47; Iss. 3

Electromigration and Thermomechanical Fatigue Behavior of Sn0.3Ag0.7Cu Solder Joints

Zuo, Yong, Bieler, Thomas R., Zhou, Quan, Ma, Limin, Guo, Fu
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Volume:
47
Language:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-017-5980-0
Date:
March, 2018
File:
PDF, 9.44 MB
english, 2018
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