[IEEE 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Haining (2017.12.14-2017.12.16)] 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Die-to-package coupling extraction for fan-out wafer-level-packaging
Peng, Yarui, Petranovic, Dusan, Lim, Sung KyuYear:
2017
Language:
english
DOI:
10.1109/EDAPS.2017.8277047
File:
PDF, 696 KB
english, 2017