[IEEE 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Chengdu, China (2017.7.4-2017.7.7)] 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Influence of the filling holes on the high temperature characteristics of deep trench superjunction MOSFET
Ren, Min, Lin, Yuci, Li, Zehong, Gao, Wei, Zhang, Jinping, Liu, Yong, Wu, Ji, Zhang, BoYear:
2017
Language:
english
DOI:
10.1109/IPFA.2017.8060160
File:
PDF, 260 KB
english, 2017