[IEEE 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Chengdu, China (2017.7.4-2017.7.7)] 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Study of silver alloy wire decapsulation methods for failure analysis
Wu, Huiwei, Liang, Yingyou, Du, Weiping, He, Shengzong, Wang, Youliang, Lei, DengyunYear:
2017
Language:
english
DOI:
10.1109/IPFA.2017.8060206
File:
PDF, 681 KB
english, 2017