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Design, Materials, Process, Fabrication, and Reliability of...

IEEE Transactions on Components Packaging and Manufacturing Technology 2018 / 6 Vol. 8; Iss. 6

Design, Materials, Process, Fabrication, and Reliability of Fan-Out Wafer-Level Packaging

Lau, John H., Li, Ming, Li, Qingqian Margie, Xu, Iris, Chen, Tony, Li, Zhang, Tan, Kim Hwee, Yong, Qing Xiang, Cheng, Zhong, Wee, Koh Sau, Beica, Rozalia, Ko, C. T., Lim, Sze Pei, Fan, Nelson, Kuah, E
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Volume:
8
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2018.2814595
Date:
June, 2018
File:
PDF, 4.50 MB
english, 2018
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