Study on the Method to Measure the Thermal Contact...

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IEEE Transactions on Power Electronics 2018

Study on the Method to Measure the Thermal Contact Resistance within Press pack IGBTs

Deng, Erping, Zhao, Zhibin, Zhang, Peng, Luo, Xiaochuang, Li, Jinyuan, Huang, Yongzhang
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Year:
2018
Language:
english
Journal:
IEEE Transactions on Power Electronics
DOI:
10.1109/TPEL.2018.2832042
File:
PDF, 1.04 MB
english, 2018
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