[IEEE 2017 IEEE 67th Electronic Components and Technology...

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[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Package-Level Si Micro-Fluid Cooler with Enhanced Jet Array for High Performance 3D Systems

Han, Yong, Lau, Boon Long, Tang, Gongyue, Low, Seow Meng, Goh, Jason
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Year:
2017
Language:
english
DOI:
10.1109/ectc.2017.42
File:
PDF, 494 KB
english, 2017
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