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[IEEE 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition - Warsaw (2017.9.10-2017.9.13)] 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition - Development of low-temperature sintering nano-silver die attach materials for bare Cu application
Sasaki, Koji, Mizumura, Noritsuka, Tsuno, Akira, Yagci, Sedat, Kopp, GerhardYear:
2017
Language:
english
DOI:
10.23919/EMPC.2017.8346875
File:
PDF, 4.80 MB
english, 2017