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[IEEE 2018 IEEE International Reliability Physics Symposium (IRPS) - Burlingame, CA (2018.3.11-2018.3.15)] 2018 IEEE International Reliability Physics Symposium (IRPS) - Study on mechanism of thermal curing in ultra-thin gate dielectrics
Mitani, Yuichiro, Higashi, Yusuke, Nakasaki, YasushiYear:
2018
Language:
english
DOI:
10.1109/IRPS.2018.8353554
File:
PDF, 1.63 MB
english, 2018