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[IEEE 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition - Warsaw (2017.9.10-2017.9.13)] 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition - Fine pitch high bandwidth flip chip package-on-package development
Hsieh, Ming-Che, Lin, Stanley, Hsu, Ian, Chen, Chi-Yuan, Cho, NamJuYear:
2017
Language:
english
DOI:
10.23919/EMPC.2017.8346847
File:
PDF, 562 KB
english, 2017