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[IEEE 2018 IEEE Applied Power Electronics Conference and Exposition (APEC) - San Antonio, TX, USA (2018.3.4-2018.3.8)] 2018 IEEE Applied Power Electronics Conference and Exposition (APEC) - Top die surface reprocessing for planar package with double sided cooling
Ning, Puqi, Li, Lei, Wen, Xuhui, Ge, Qiongxuan, Li, Yaohua, Mei, YunhuiYear:
2018
Language:
english
DOI:
10.1109/APEC.2018.8341411
File:
PDF, 1.19 MB
english, 2018