Accelerated temperature cycling induced strain and failure...

Accelerated temperature cycling induced strain and failure behaviour for BGA assemblies of third generation high Ag content Pb-free solder alloys

Dalton, Eric, Ren, Guang, Punch, Jeff, Collins, Maurice N.
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Volume:
154
Language:
english
Journal:
Materials & Design
DOI:
10.1016/j.matdes.2018.05.030
Date:
September, 2018
File:
PDF, 1.42 MB
english, 2018
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