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Quantitative analysis of nano-defects in thin film encapsulation layer by Cu electrodeposition
Chu, Kunmo, Bae, Ki Deok, Song, Byong Gwon, Kim, Jaekwan, Park, Yong Young, Xianyu, Wenxu, Lee, Chang Seung, Sohn, YoonchulVolume:
453
Language:
english
Journal:
Applied Surface Science
DOI:
10.1016/j.apsusc.2018.05.072
Date:
September, 2018
File:
PDF, 1.30 MB
english, 2018