Material removal of single crystal 4H-SiC wafers in hybrid...

Materials Science in Semiconductor Processing 2018 / 08 Vol. 82

Material removal of single crystal 4H-SiC wafers in hybrid laser-waterjet micromachining process

Feng, Shaochuan, Huang, Chuanzhen, Wang, Jun, Zhu, Hongtao
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Volume:
82
Language:
english
Journal:
Materials Science in Semiconductor Processing
DOI:
10.1016/j.mssp.2018.03.035
Date:
August, 2018
File:
PDF, 3.01 MB
english, 2018
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