[ASME ASME 2003 International Electronic Packaging Technical Conference and Exhibition - Maui, Hawaii, USA (July 6–11, 2003)] 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1 - Deformation Characteristics of Solder Joints
Bastawros, Ashraf, Antoniou, AntoniaYear:
2003
Language:
english
DOI:
10.1115/IPACK2003-35078
File:
PDF, 772 KB
english, 2003