Cu-SiO2 hybrid bonding simulation including surface...

Microelectronics Reliability 2018 / 07 Vol. 86

Cu-SiO2 hybrid bonding simulation including surface roughness and viscoplastic material modeling: A critical comparison of 2D and 3D modeling approach

Wlanis, Thomas, Hammer, René, Ecker, Werner, Lhostis, Sandrine, Sart, Clément, Gallois-Garreignot, Sébastien, Rebhan, Bernhard, Maier, Günther A.
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Volume:
86
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2018.05.005
Date:
July, 2018
File:
PDF, 2.45 MB
english, 2018
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