Crystalline defect formation on aluminum bond pads during...

Crystalline defect formation on aluminum bond pads during CMOS wafer storage and process strategies for defect elimination

Pani, Santosh Kumar, Hogan, Royston Hugh, Pandurangan, Madhavan, Nistala, Ramesh Rao
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Volume:
36
Language:
english
Journal:
Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena
DOI:
10.1116/1.5027149
Date:
May, 2018
File:
PDF, 1.67 MB
english, 2018
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