Immersion Cooling of Electronics Utilizing Lotus-Type Porous Copper
Yuki, Kazuhisa, Hara, Tomohiro, Ikezawa, Soichiro, Anju, Kentaro, Suzuki, Koichi, Ogushi, Tetsuro, Ide, Takuya, Murakami, MasaakiVolume:
9
Year:
2016
Language:
english
Journal:
Transactions of The Japan Institute of Electronics Packaging
DOI:
10.5104/jiepeng.9.e16-013-1
File:
PDF, 1.72 MB
english, 2016