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Microstructural evolution of Cu–Sn–Ni compounds in full intermetallic micro-joint and in situ micro-bending test
Mo, Liping, Guo, Chaowei, Zhou, Zheng, Wu, Fengshun, Liu, ChangqingLanguage:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-018-9293-8
Date:
May, 2018
File:
PDF, 2.83 MB
english, 2018