Shear strength and fracture surface analysis of Sn58Bi/Cu...

Microelectronics Reliability 2018 / 07 Vol. 86

Shear strength and fracture surface analysis of Sn58Bi/Cu solder joints under a wide range of strain rates

Wan, Yongqiang, Li, Shuang, Hu, Xiaowu, Qiu, Yu, Xu, Tao, Li, Yulong, Jiang, Xiongxin
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Volume:
86
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2018.05.007
Date:
July, 2018
File:
PDF, 7.19 MB
english, 2018
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