Forensic smartphone analysis using adhesives: Transplantation of Package on Package components
Heckmann, Th, Markantonakis, K., Naccache, D., Souvignet, ThLanguage:
english
Journal:
Digital Investigation
DOI:
10.1016/j.diin.2018.05.005
Date:
May, 2018
File:
PDF, 9.28 MB
english, 2018