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Effect of the Soldering Atmosphere on the Wettability Between Sn4.0Ag0.5Cu (in wt.%) Lead-Free Solder Paste and Various Substrates
Soares, D., Leitão, H., Lau, C. S., Teixeira, J. C., Ribas, L., Alves, R., Teixeira, S., Cerqueira, M. F., Macedo, F.Language:
english
Journal:
Journal of Materials Engineering and Performance
DOI:
10.1007/s11665-018-3419-2
Date:
May, 2018
File:
PDF, 696 KB
english, 2018