[IEEE 2018 19th International Conference on Thermal,...

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[IEEE 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Toulouse, France (2018.4.15-2018.4.18)] 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Investigation of trapping behaviour in GaN HEMTs through physical TCAD simulation of capacitance voltage characteristics

Mukherjee, K., Curutchet, A., Darracq, F., Malbert, N., Labat, N.
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Year:
2018
Language:
english
DOI:
10.1109/EuroSimE.2018.8369924
File:
PDF, 469 KB
english, 2018
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