Thermal Stress Analysis of Pin Grid Array Structures: Pin...

Thermal Stress Analysis of Pin Grid Array Structures: Pin and Solder Joint Problems

Engel, Peter A., Wu, Kee Rong
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Volume:
114
Year:
1992
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2905457
File:
PDF, 643 KB
english, 1992
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