[IEEE 2018 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL) - Moltrasio (2018.3.26-2018.3.29)] 2018 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL) - Theoretical model and experiments of glass reflow process in TGV for 3D wafer-level packaging
Kuang, Yunbin, Xiao, Dingbang, Zhou, Jian, Li, Wenyin, Hou, Zhanqiang, Cui, Hongjuan, Wu, XuezhongYear:
2018
Language:
english
DOI:
10.1109/ISISS.2018.8358134
File:
PDF, 696 KB
english, 2018